IC Resources Ltd

Principal Engineer - Semiconductor Manufacturer

2 days left

Location
China
Salary
Excellent Salary + Benefits
Posted
28 Oct 2017
Closes
25 Nov 2017
Ref
J41659
Contact
Ye Su
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Principal Engineer - Semiconductor Manufacturer
China
Excellent Salary + Benefits

A major manufacturer is currently seeking an experienced Principal Engineer to join its China team.

Your responsibilities
*Set strategy and lead efforts for developing surface treatment and plating process technology for IC Substrate and related products for next generations
*Design product and process technology roadmaps to provide direction and guidance for technology development ahead of market demand
*Benchmark and identify technology gaps and drive equipment, process, chemical and material exploration projects internally or with external partners
*Partner with R&D Management, Process Development teams, Sales, Customers and Suppliers to track market and technology trends
*Establish and maintain performance standards for processes, methods and tools to compensate, skew and optimize process recipes
*Integrate development and production activities to transfer and qualify technology for High Volume Manufacturing

Your Profile
Master's Degree in Engineering, Chemistry, Materials Science, Physics or related discipline
Expert knowledge in Surface Treatment and Plating Technologies in the IC Substrate or related industries
At least 5 years of direct experience in Surface treatment and Plating process development, technology transfer and process integration
Demonstrated ability to successfully lead development projects (design of experiments, data-driven development)
Self-driven, communicative personality with the ability to think outside the box and look into the future
Excellent analytical problem resolution and organizational skills for managing on-going /future programs
Proactive team player with hands on mentality
English proficiency (Mandarin a plus)
Willingness to travel

Keywords: PCB, IC Substrate, Plating, Surface Finish

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