IC Resources Ltd

Semiconductor Packaging Engineer

Location
Bristol
Salary
Negotiable
Posted
16 Oct 2018
Closes
13 Nov 2018
Ref
JO-1810-135255
Contact
Rachel Anderson
Job Function
Design
Contract Type
Permanent
Hours
Full Time

Our client is now searching for a Semiconductor Packaging Engineer to be responsible for the R&D and engineering support for the packaging of new IC products. The role will involve new package design and material selection as well as subcontractor technical management. A certain amount of reliability test planning and failure analysis will also be required.


Required skills for the Senior IC Packaging Engineer include;


- Strong semiconductor packaging experience (flipchip / BGA)

- 3D packaging knowledge

- Semiconductor reliability knowledge

- Excellent communication skills

- BSc Degree in Electrical Engineering/Physics or related discipline


Please contact Rachel@ic-resources.com to discuss further.





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