IC Resources Ltd

Head of Semiconductor Advanced Packaging

4 days left

Location
Wales
Salary
Attractive salary + benefits
Posted
24 Jul 2018
Closes
21 Aug 2018
Ref
JO-1807-133643
Contact
Rachel Anderson
Job Function
Design
Specialist Area
Hardware
Contract Type
Permanent
Hours
Full Time

Head of Semiconductor Advanced Packaging

Attractive salary + Benefits


Our client is currently searching for the Head of Advanced Packaging to lead the semiconductor packaging team. The role will involve developing and leading packaging activities within the company and growing the team. Working with the business development team to drive projects and support bid writing will also be part of the role.


Required experience for the Advanced Packaging Head will be as follows,


- Strong semiconductor advanced packaging knowledge

- Semiconductor manufacturing experience

- Team leadership and project management experience

- Engineering Degree / PhD in Electronic Engineering / Physics or equivalent


Please call Rachel to discuss further.

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