IC Resources Ltd

Semiconductor Packaging Modelling and Simulation Engineer

Location
East of England
Salary
Competitive Salary + Benefits
Posted
25 Feb 2017
Closes
25 Mar 2017
Ref
J40119
Contact
Rachel Anderson
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Semiconductor Packaging Modelling and Simulation Engineer
East Anglia
Competitive Salary + Benefits

Our client is currently searching for a Packaging Engineer to join the product engineering team of a fabless company. The role will involve working on advanced package process flows and assembly yield improvement. The role will involve working on materials integrity characterisation as well as DOE design and chip package failure analysis.

Required skills include;

-Strong semiconductor package experience
-Mechanical, thermal and electrical modelling knowledge
-Yield analysis and improvement skills
-Excellent communication skills
-BSc Degree in Electrical Engineering/Physics or related discipline

Please call us to discuss further.


A number of the following key skills are required: IC, semiconductor, packaging, materials, failure analysis, modelling, simulation, thermal, senior, engineer, fab, wafer, product, manufacturing, jobs