IC Resources Ltd

Principal Package Design Engineer - Cambridge

Location
Cambridge
Salary
Competitive Salary and Benefits
Posted
23 Feb 2017
Closes
23 Mar 2017
Ref
J38842
Contact
Rachel Anderson
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Principal Package Design Engineer - Cambridge

Our client is searching for a Principal Package Design Engineer to be responsible for providing IC package solutions for advanced packaging technology development. Designing new packages will be required as well as package pinout optimization. Working with various corporate divisions will be part of the role.

Required skills for the Packaging Engineer will include;

-Strong semiconductor IC advanced packaging experience
-Flip Chip, SiP, FCCSP knowledge
-Excellent communication skills
-BSc Degree qualified materials, physics, electronics or equivalent

Please call us to discuss further.

A number of the following key skills will be required for the role: Semiconductor, IC, packaging, flip chip, SiP, CSP, engineer, design, device and manufacturing