Principal Package Design Engineer - Cambridge
- Recruiter
- IC Resources Ltd
- Location
- Cambridge
- Salary
- Competitive Salary and Benefits
- Posted
- 03 Oct 2016
- Closes
- 31 Oct 2016
- Ref
- J32407
- Contact
- Rachel Anderson
- Job Function
- Manufacturing & Production
- Specialist Area
- Semiconductors
- Contract Type
- Permanent
- Hours
- Full Time
Principal Package Design Engineer - Cambridge
Our client is now searching for a Principal Package Design Engineer to be responsible for providing IC package solutions for advanced packaging technology development. Designing new packages will be required as well as package pinout optimization. Working with various corporate divisions will be part of the role.
Required skills for the Packaging Engineer will include;
-Strong semiconductor IC advanced packaging experience
-Flip Chip, SiP, FCCSP knowledge
-Excellent communication skills
-BSc Degree qualified materials, physics, electronics or equivalent
Please call us to discuss further.
A number of the following key skills will be required for the role: Semiconductor, IC, packaging, flip chip, SiP, CSP, engineer, design, device, manufacturing