IC Resources Ltd

Package Development Engineer - East Anglia

Location
Cambridge
Salary
Competitive salary + benefits
Posted
16 Sep 2016
Closes
14 Oct 2016
Ref
J37841
Contact
Rachel Anderson
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Package Development Engineer - East Anglia

Our international client now requires a Package Development Engineer to lead the design of semiconductor packages. Identifying package requirements and interfacing with subcontractors will be part of the role as well as defining packaging roadmaps and strategic plans for future packages. Packages will include QFN, WLCSP and BGA.

Required skills include;
-Good knowledge of IC semiconductor packaging
-Package design tool experience (Cadence APD, Virtuoso, Autocad)
- Experience of working within a high volume semiconductor manufacturing environment
-Ability to work with various departments within the company
-Far Eastern subcontractor experience desirable
-BSC Degree or equivalent qualifications

Please call us to discuss further.

A number of the following key skills will be required for the role: IC, semiconductor, packaging, engineer, QFN, WLCSP, BGA, Cadence, APD, subcontractor, manufacturing, jobs

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