IC Resources Ltd

Principal Package Design Engineer - Cambridge

7 days left

Location
Cambridge
Salary
Competitive Salary and Benefits
Posted
04 Sep 2016
Closes
02 Oct 2016
Ref
J32407
Contact
Rachel Anderson
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Principal Package Design Engineer - Cambridge

Our client is now searching for a Principal Package Design Engineer to be responsible for providing IC package solutions for advanced packaging technology development. Designing new packages will be required as well as package pinout optimization. Working with various corporate divisions will be part of the role.

Required skills for the Packaging Engineer will include;

-Strong semiconductor IC advanced packaging experience
-Flip Chip, SiP, FCCSP knowledge
-Excellent communication skills
-BSc Degree qualified materials, physics, electronics or equivalent

Please call us to discuss further.

A number of the following key skills will be required for the role: Semiconductor, IC, packaging, flip chip, SiP, CSP, engineer, design, device, manufacturing

Apply for Principal Package Design Engineer - Cambridge

Already uploaded your CV? Sign in to apply instantly

All answers are required

Apply
}

Your CV must be a .doc, .pdf, .docx, .rtf, and no bigger than 1MB


4000 characters left


By applying for a job listed on Electronics Weekly Jobs you agree to our terms and conditions and privacy policy. You should never be required to provide bank account details. If you are, please email us.