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IC Resources Ltd

Packaging Engineer - Simulation

This job has now expired

IC Resources Ltd
13 March 2014
10 April 2014
Rachel Anderson
East of England
Specialist Area
Contract Type
Competitive salary + benefits

Further information

Our successfully growing client now requires a Packaging Engineer to perform thermal and electrical simulations of new IC products. Producing package models and application models for PCBs will be part of the role as well as Wafer Level Chip Scale Package and BGA simulations.

Required skills include;
-Semiconductor Packaging modelling experience
- Thermal / electrical simulation software knowledge
- Excellent communication and motivational skills
-BSc Degree in Electronics / Physics or equivalent qualifications

Please call us to discuss further.

Key skills: semiconductor, IC, model, modelling, engineer, thermal, electrical, simulation, PCB, BGA, WLCSP, manufacturing, jobs

IC Resources - your first contact for semiconductor manufacturing & IC test jobs globally.

IC Resources Ltd

Our team of 50 consultants offers more than 500 years of industry and specialist recruitment experience in the Semiconductor, Software, Electronics, and User Experience arenas.

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