IC Resources Ltd

Packaging Engineer - Simulation

Location
East of England
Salary
Competitive salary + benefits
Posted
13 Mar 2014
Closes
10 Apr 2014
Ref
J25208
Contact
Rachel Anderson
Specialist Area
Semiconductors
Contract Type
Permanent
Hours
Full Time
Our successfully growing client now requires a Packaging Engineer to perform thermal and electrical simulations of new IC products. Producing package models and application models for PCBs will be part of the role as well as Wafer Level Chip Scale Package and BGA simulations.

Required skills include;
-Semiconductor Packaging modelling experience
- Thermal / electrical simulation software knowledge
- Excellent communication and motivational skills
-BSc Degree in Electronics / Physics or equivalent qualifications

Please call us to discuss further.



Key skills: semiconductor, IC, model, modelling, engineer, thermal, electrical, simulation, PCB, BGA, WLCSP, manufacturing, jobs

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