Packaging Engineer - Simulation
This job has now expired
Required skills include;
-Semiconductor Packaging modelling experience
- Thermal / electrical simulation software knowledge
- Excellent communication and motivational skills
-BSc Degree in Electronics / Physics or equivalent qualifications
Please call us to discuss further.
Key skills: semiconductor, IC, model, modelling, engineer, thermal, electrical, simulation, PCB, BGA, WLCSP, manufacturing, jobs
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