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Our client is looking for an expert 3D Integration Engineer to act as a representative of the company at a top Research Institute.
WE are looking for someone with :-
-Extensive experience in the semiconductor industry including 3D chip stacking with a Ph.D. degree in Physics, EE or related
- Knowledge and understanding of design methodologies and EDA tools is desirable, specifically as they apply to 3D stacking.
-Familiarity with and understanding of the Si process and Packaging and Assembly processes is desirable .
-Experience with working with Fabs and SAT providers is desirable
-Proven ability and track record of learning new skills and willingness to take on new projects that require incremental learning, i.e proven track record of willingness to operate in new and unfamiliar environments.
Knowledge of advanced CMOS device or chip package interaction (CPI) would be a plus
- Be a conduit between the various relevant groups of our clients and the staff at the institue on 3D Thru Silicon Stacking and Insite Programs.
- Help define and coordinate our clients inputs to the institutes program, and communicate the data and relevant responses back to the teams.
If you are interested in the 3D Integration Engineer role and have the relevant skills for the positin then please do send an up to date CV to me at email@example.com or simply click apply.
Key Words :- 3D, Integration, Packaging, IC, IC packaging, TSV, RDL, Silicon