Japan-based opportunity for a Principal Digital Chip Lead. Digital, ASIC, mixed signal, IC Design, Japan, East Asia.
A key position has arisen for a Principal IC Design Lead to head up a growing IC design team based in Yokohama, Japan. This group is developing complex high performance mixed signal ICs for consumer applications.
The Principal IC Design Lead will take ownership of the full chip project and lead a cross-functional mixed signal IC design team from architecture definition through to timely delivery. This team encompasses engineers working in Digital IC Design, Verification, layout, analogue design, DfT and Place& Route (P&R) hence the successful candidate should have detailed knowledge in each area. In addition, together with the Technical Directors, the Principal Lead will assess and define technical roadmaps for future products, play a significant role in developing innovative new design methodologies and implement these across the company.
The successful candidate will be a highly experienced IC Design veteran with a solid understanding of Digital and mixed signal IC Design and a sound system-level understanding overall.
A highly competitive salary package will be offered to the right candidate.
Key words: IC Design, Chip, ASIC, Digital, Analog, mixed signal, Verification, Layout, Design for Test, DFT, P&R, STA, digital filter design, FIR, DSP, delta-sigma, audio, power, Semiconductor, Lead, Japan, Asia
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