Our client now requires a Package Development Technology Engineer to be responsible for developing new IC packages. The role will involve working with both the process development teams, as well as the package development teams. Co-ordinating with different technical areas of the company will be required.
Required skills for the Package Development Technology Engineer include;
-Strong semiconductor packaging technology experience
-Power semiconductor knowledge
-Excellent communication and motivation skills
-BSc Degree or equivalent qualifications
Please call us to discuss further.
Key skills: IC, semiconductor, Halbleiter, engineer, package, packaging, manufacturing, development, R&D, power, jobs, Austria
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