Our client is currently searching for an IC Packaging Project Manager to be responsible for managing new package development projects. The role will involve running package design and development programs as well as leading team members to achieve high performance and delivery of projects.
The successful candidate will have the following qualifications;
-Strong IC semiconductor package development experience
-Advanced package knowledge eg QFN
-Excellent communication skills and ability to work with different departments
-BSc. degree in engineering, physics, or equivalent
Please call to discuss further.
Key Words: IC, semiconductor, packaging, engineer, PMP, project, manager, QFN, advanced packages, manufacturing, Hong Kong, Asia, jobs
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