IC Packaging Project Manager - Hong Kong
This job has now expired
The successful candidate will have the following qualifications;
-Strong IC semiconductor package development experience
-Advanced package knowledge eg QFN
-Excellent communication skills and ability to work with different departments
-BSc. degree in engineering, physics, or equivalent
Please call to discuss further.
Key Words: IC, semiconductor, packaging, engineer, PMP, project, manager, QFN, advanced packages, manufacturing, Hong Kong, Asia, jobs
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